Eric Beyne (Imec)
The future of electronic systems: 3D heterogeneous partitioning and technology, from multi-chip modules to CMOS 2.0

Kouchi Zhang (Delft University of Technology)
Enabling the “Electronics Cambrian Explosion” by heterogeneous system integration and packaging – No permission to share

André van Geelen (Coolsem)
Redefining chip cooling for next-generation heterogeneous platforms

Joep Stokkermans (Itec Equipment)
Driving advanced packaging from core competence to core business

James Robinson (Infinitesima)
Angstroms to millimeters: holistic surface characterization for 3D integration via hybrid optical AFM metrology

Gerwin Gelinck (TNO/PITC/University of Twente)
When lasers build chips: a new path to photonic chip assembly

Martijn Heck (Eindhoven University of Technology)
Integrated photonics and electronics – a forced marriage?

Vishal Saroha (Yole Group)
Heterogeneous integration at scale: the equipment race shaping the next semiconductor era