28 May 2025 | Mikrocentrum Veldhoven

28 May 2025

Mikrocentrum Veldhoven

Exhibition and conference focusing on RF development and applications

Keynote

Mark Rodwell
(University of California, Santa Barbara)

Keynote

Carolina Vigano
(Viasat)

Silver sponsors

rohde&schwarz

Silver sponsors

Bronze sponsors

bsw TestSystems & Consulting
High Tech Institute

Sponsors

TNO logo

Partners

Everything RF logo
IR Search

Program

09:00-09:30

Registration

During the conference, visitors can roam the exhibition floor to meet our sponsors, network with other attendees and check out the poster presentations by our regional PhD talent.

09:30-10:15

Keynote

100-300 GHz wireless, 100-300 GHz InP ICs: is either useful?
Mark Rodwell (University of California, Santa Barbara)
100-300 GHz wireless, 100-300 GHz InP ICs: is either useful?
Mark Rodwell (University of California, Santa Barbara)
During the 5G craze, 28/39 GHz iPhones were sold, E-band backhaul was contemplated and next-generation 100-300 GHz 6G wireless research was started. But, even 28/39 GHz failed commercially, and industry retreated to ~6-12 GHz. Yet, 100-300 GHz InP/CMOS wireless can provide ~1 Tb/s aggregate capacity over short range (~100-700 m) endpoint and backhaul links. Shifting car radar from 75 to 300 GHz would give 4:1 sharper resolution, the difference, perhaps between someone standing on the road vs. on the sidewalk.
Are such systems useful or their development profitable? This depends on cost, range, resolution (radar) and desired Gb/s/km2 data density (wireless). Though cheap short-range D-band CMOS transceivers are feasible, CMOS/InP chipsets are key for longer-range D-band and for systems above ~170 GHz. Compared to CMOS, SiGe and GaN, InP HBT has demonstrated far better power and efficiency, and InP HEMT far better noise. Yet, 13 years after demonstration of THz InP HBTs and HEMTs, there’s no high-volume production. Cost and market demand are key.
Mark Rodwell (PhD Stanford 1988) holds the Doluca Family Endowed Chair in Electrical and Computer Engineering at UCSB. He directed the SRC/DARPA Comsenter wireless research center (2017-2023), the SRC Nonclassical CMOS research center (2007-2014) and the UCSB Nanofabrication Lab (1996-2018). His research group develops nm and THz transistors and high-frequency integrated circuits and wireless communications systems.

10:15-11:00

EuMA PhD pitches

Berke Güngör (KU Leuven)
Non-coherent TX-RX chipsets for J-band communication in 16-nm FinFET CMOS
Kevin van Hastenberg (Eindhoven University of Technology)
Novel dual-frequency SIW to rectangular waveguide diplexer for 77 GHz and 130 GHz automotive radar
Mohammad Khorramizadeh (Eindhoven University of Technology)
Assessment of different scenarios on input impedance of a thin wire
Ashwita Nair (Delft University of Technology)
A distributed radar architecture above 100 GHz using lens arrays for sensing applications
Justin Romstadt (Ruhr-University Bochum)
A D-band single SiGe MMIC vector network analyzer extension module

11:00-11:30

Break

11:30-12:00

InP for RF

11:30-12:00

Packaging

InP electronics from a photonics foundry perspective
Luc Augustin (Smart Photonics)
InP electronics from a photonics foundry perspective
Luc Augustin (Smart Photonics)
Indium phosphide (InP) stands out as the sole material capable of producing lasers for telecom and datacom applications. Additionally, InP is used for fast optical modulators, making it the ideal material for integrating multiple functionalities. As a photonics foundry, Smart Photonics specializes in photonic integrated circuits based on InP and provides a robust process design kit tailored to photonics.
InP is the main candidate to address the increasing demand for high-speed RF components. To enable a large uptake of InP-based electronics, we need to solve the same challenges as we’re addressing in InP photonics, such as massive cost reduction through standardization of processes and scaling. Our approach focuses on utilizing the same rigorous design and manufacturing techniques proven in photonics. We’re positioned to leverage our existing investments to overcome these hurdles, ensuring they meet the industry’s evolving demands.
Luc Augustin received the MSc and PhD degrees in electrical engineering from Eindhoven University of Technology. He’s the CTO of Smart Photonics, where he’s responsible for the technology roadmap and product management. His expertise is in photonics, fabrication and characterization of InP photonic integrated circuits. Prior to Smart, he worked at Solland Solar, Philips Research and Cedova, where he always has been active in the development, pilot production and optimization of innovative technologies. In 2023, he was also appointed part-time associate professor at Eindhoven University of Technology. His area of research is large-scale integration of PICs.
Molded interconnect device technology integration of a photonics-based automotive radar
Stephan Kruse (University of Paderborn)
Molded interconnect device technology integration of a photonics-based automotive radar
Stephan Kruse (University of Paderborn)
A candidate for enabling autonomous driving is high-resolution radar. State-of-the-art pure electronic radars are limited in angular resolution. In phased-array or MIMO systems, the angular resolution is inversely proportional to the antenna’s aperture. In pure electronic radar systems, the aperture size is limited by the losses of the electrical LO distribution. In comparison, fiber-optical signal distribution has almost no losses, enabling arbitrary aperture sizes and resulting in arbitrary angular resolution.
The first half of this talk will cover system design considerations and design methodologies for the world’s first photonics-based 77 GHz radar chipset, as well as present a demonstrator. The demonstrator has an aperture size of approximately 0.5 m and achieves an angular resolution of 0.3°. The second half of the talk will focus on the integration of such a photonic radar into a car bumper, using molded interconnect device (MID) technology. This presents many challenges. The talk will share the first results and trade-offs.
Stephan Kruse received his BSc and MSc degrees in electrical engineering from the University of Paderborn, Germany, in 2015 and 2017, respectively. He’s currently in the final stages of his doctoral studies at the Heinz Nixdorf Institute in Paderborn, focusing on photonic radar circuits and systems for coherent mm-wave large aperture phased-array MIMO systems. Since 2022, he’s been the leader of the mm-wave/THz systems and circuits subgroup of the System and Circuit Technology Group. In addition to his affiliation with the Heinz Nixdorf Institute, he’s been a member of the Institute for Photonic Quantum Systems (Phoqs) in Paderborn since 2023. His current research interests include high-frequency optoelectronics, quantum optics and particularly the optimization of (opto)electronic systems with quantum optics.

12:00-12:30

InP for RF

12:00-12:30

Packaging

InP for RF: lessons learned from real-world chip designs
Senne Gielen (KU Leuven)
InP for RF: lessons learned from real-world chip designs
Senne Gielen (KU Leuven)
Indium phosphide (InP) is a promising semiconductor technology for high-frequency RF and mm-wave applications, offering superior performance in terms of gain, efficiency, noise and output power. However, designing RFICs in InP comes with unique challenges that require careful consideration of layout parasitics and fabrication constraints.
This talk will present practical insights from our InP chip designs, including successful implementations in D-band and up to the THz range, as well as case studies of circuits that didn’t perform as expected. By analyzing both successes and mishaps, we’ll highlight key design trade-offs, common pitfalls and strategies for optimizing high-frequency circuits in InP. Topics will include circuit and layout techniques, as well as packaging considerations.
Attendees will gain a deeper understanding of the practical aspects of InP IC design, helping them navigate the challenges of working with this high-performance technology.
Senne Gielen obtained the BSc and MSc degrees in electrical engineering from KU Leuven, Belgium, in 2017 and 2020, respectively. He’s currently pursuing the PhD degree with KU Leuven’s MICAS research group. At the 2023 RFIC Symposium, he won 3rd place in the Best Student Paper Competition. His research interests include mm-wave and THz integrated circuits for high-speed communication in CMOS and III-V technologies.
Waveguide launchers in package for high-performance mm-wave automotive radars
Waqas Syed (NXP)
Waveguide antenna interfaces for high-performance mm-wave automotive MIMO radars
Waqas Syed (NXP)
The race to self-driving cars has been one of the key drivers behind the recent advancements of mm-wave automotive radar sensors. To enable level 3 and urban level 4 autonomous driving, future sensors need to offer high angular resolution that allows to detect small objects next to large objects at long range, provide elevation angular coverage and 360° coverage around the car.
To achieve such performances, large antenna arrays are required, implemented with multiple mm-wave front-end ICs and powerful microprocessors. Lower power dissipation, smaller sensor size and seamless integration into the car chassis become leading requirements for such sensors, and the interface between the antenna and the IC a determining factor for all these.
This talk will focus on the recent developments in automotive radar antennas, covering the industry’s transition from microstrip-based antennas to state-of-the-art waveguide-based antennas, enabled by novel antenna-to-die interfaces employing waveguide launchers in advanced packaging and RFCMOS technologies. Future challenges with respect to antennas and packages for automotive radars beyond 76-81 GHz will also be discussed.
Waqas Syed received his MSc degree from RWTH Aachen University, Germany, in 2010 and his PhD degree (cum laude) in electromagnetics from Delft University of Technology, the Netherlands, in 2015. From 2015-2016, he worked as a post-doctoral researcher in the Terahertz Sensing Group at TU Delft. Since 2016, he’s been working at NXP as an EM antenna engineer. Syed was a recipient of the Special Mention for Excellent Presentation at the European Conference on Antennas and Propagation in 2015 and the 2016 Else Kooi Award for the Best Young Researcher in the field of applied semiconductor research and microelectronics conducted in the Netherlands.

12:30-13:30

Lunch

13:30-14:00

RF from space

13:30-14:00

RF on the factory floor

Wireless power transfer: from microwatts powering wireless sensors to megawatts from space powering cities
Hubregt Visser (Imec NL)
Wireless power transfer: from microwatts powering wireless sensors to megawatts from space powering cities
Hubregt Visser (Imec NL)
Wireless power transfer (WPT) has become available in consumer products in the form of inductive WPT for charging smartphones and watches. It’s also used for powering biomedical implants and is available for powering electric cars. It can transfer medium to high power levels but is limited by the transfer distance.
Using radio waves to transfer power over a distance of several meters is feasible for wireless sensors consuming a few hundred microwatts, but this application hasn’t aroused interest yet. We do see a growing interest though in using radio waves for beaming high (up to hundreds of megawatts) power levels. This is for solar power satellite projects wherein a satellite in space converts solar energy into RF energy and beams this to Earth where it’s converted to direct current energy using large area rectifying antennas.
This talk will discuss the state of the art of all mentioned forms of WPT.
Hubregt Visser received the MSc degree in electrical engineering from Eindhoven University of Technology in 1989 and the PhD degree from TUE and KU Leuven in 2009. In 1989, he joined TNO, first in The Hague and since 2001 in Eindhoven. He’s worked on antenna measurement, MMIC design, array antenna design and antenna miniaturization. In 2009, he joined Imec NL, working on wireless power transfer and UWB antenna design. Since 2014, he’s a part-time full professor at TUE.
Precision D-Band radar sensors for industrial applications
Timo Jaeschke (2pi-Labs)
Precision D-Band radar sensors for industrial applications
Timo Jaeschke (2pi-Labs)
This talk will explore the transformative capabilities of precision D-Band radar sensors for industrial applications, highlighting the latest regulatory advancements, sensor design innovations and quality assurance applications. Recent updates in EU frequency regulation have expanded the extended D-Band (116-182 GHz) spectrum for industrial use, creating unique opportunities for innovative applications that elevate operational accuracy, safety and efficiency.
We’ll delve into the design of broadband, high-stability FMCW radar sensors engineered to meet the rigorous demands of modern industry. These sensors deliver robust, real-time measurements in challenging environments, offering a new dimensions of precision essential for automation and Industry 4.0 applications.
We’ll also discuss cutting-edge quality assurance applications, including SAR imaging, non-contact thickness and basis weight measurement, permittivity assessment and highly accurate distance measurement. By presenting viable, high-precision alternatives to nuclear and X-ray sensors, D-Band radar technology opens new pathways for non-destructive quality control solutions.
Timo Jaeschke was born in Hattingen, Germany, in 1984. He received the Dipl.-Ing. and Dr.-Ing. degrees in electrical engineering from Ruhr University Bochum, Bochum, Germany, in 2011 and 2017, respectively. From 2011 to 2018, he has been a research assistant with the Institute of Integrated Systems, Ruhr University Bochum. He’s currently the CEO of 2pi-Labs, a precision mm-wave sensor company, in Bochum. His current research interests include wideband FMCW radar systems up to 240 GHz, high-resolution radar imaging and highest-precision distance measurements for various applications.

14:00-14:30

RF from space

14:00-14:30

RF on the factory floor

Space meets telecom: the rise of non-terrestrial networks
Werner Coomans (Nokia Bell Labs)
Space meets telecom: the rise of non-terrestrial networks
Werner Coomans (Nokia Bell Labs)
Over the past decade, we’ve entered a new era in which space is increasingly being commercialized, buoyed by a revolution in satellite launch capabilities. Part of this trend is the increasing convergence between the terrestrial telecom industry and the satellite industry, and the growth of so-called “non-terrestrial” networks in addition to existing terrestrial networks. Notably, such non-terrestrial networks played an important role in a range of recent events, such as disaster recovery and even military campaigns.
This talk will introduce the key concepts underpinning the most popular type of non-terrestrial networks: satellite networks. It will give an overview of the industry, cover envisaged use cases (eg direct-to-device connectivity) and address some of the technical characteristics and ongoing standardization efforts. It will also provide a sneak peek into the future, where terrestrial communication technologies will increasingly be leveraged beyond Earth, starting with the moon.
Werner Coomans is a technology advisor in Nokia’s Technology Leadership Office, advising senior management on technology strategy and innovation. Before that, he was first a researcher and then department head of the Fixed Networks research department at Nokia Bell Labs, which he joined in 2013 after obtaining a PhD degree in electrical engineering/photonics. His research at Bell Labs focused on fixed network technologies. He’s a Bell Labs Distinguished Member of Technical Staff (DMTS).
5G coverage and channel simulation in a complex industrial environment
Karthikeyan Sukumar (Dassault)
5G coverage and channel simulation in a complex industrial environment
Karthikeyan Sukumar (Dassault)
Industry 4.0 and the digitalization of factories promise enormous benefits in terms of efficiency, productivity and sustainability. 5G private networks will deliver the required networking performance, and initial industrial deployments are showing promise.
However, modern factories or assembly halls are complex environments. Planning robust wireless connections in smart factories requires an understanding of coverage and individual channel responses. Ray-tracing-based simulation plays an important role in predicting this behavior, complementing costly and time-consuming measurement campaigns in existing real-world environments and forecasting performance in planned facilities. This digital or virtual twin model of the factory environment can help minimize the number of access points while optimizing coverage before the factory is upgraded or built.
This talk will describe a flexible ray-tracing-based workflow for analyzing coverage and communication channels in such complex and dynamic environments. Topics will include preparing realistic 3D factory models with moving elements for simulation, assessing the impact of antenna positioning on channel predictions and simulating scenarios to predict coverage and channel responses.
Karthikeyan Sukumar is an electromagnetics industry process consultant at Dassault Systèmes Simulia, with seven years of experience in the microwave, RF and high-performance computing (HPC) domains. He’s spent five years in tech sales and two and a half years in support. In the HPC field, he’s contributed to optimizing computing environments to ensure efficient and scalable simulation processes for demanding tasks. He holds an engineering degree in electronics and communication from Anna University, Chennai. His expertise bridges cutting-edge simulation technologies with practical, real-world industry applications.

14:30-15:00

Break

15:00-15:30

Circuit design

15:00-15:30

Test & measurement

Benelux RF conference Alexander Doust
Revolutionizing RF front-end design: unlocking the future of multiband mobile technologies
Alexander Doust (Forefront RF)
Benelux RF conference Alexander Doust
Revolutionizing RF front-end design: unlocking the future of multiband mobile technologies
Ronald Wilting (Forefront RF)
The ever-expanding demand for faster data speeds and more efficient mobile communication has outpaced conventional RF Front-End design approaches. With the proliferation of 5G and emerging technologies, the need for compact, high-performance solutions that support multiple frequency bands has never been greater. Enter Forefront RF’s game-changing innovation: a frequency-agnostic RF Front-End powered by Foretune™ technology. This presentation delves into how Forefront RF is overcoming the limitations of traditional fixed-frequency components by introducing dynamically tunable solutions that reduce size, complexity, and environmental impact. Attendees will explore the integration of self-interference cancellation techniques, enabling unparalleled performance and efficiency. Discover how Forefront RF’s patented technology is paving the way for a new era of RF design, simplifying architectures for smartphones, IoT devices, and wearables, while reducing costs and enhancing sustainability. Join us to witness the future of mobile radio technology unfold.
Alexander Doust is the Director of Business Development of Forefront RF, a pioneering fabless semiconductor company specializing in RF modules and analogue integrated circuits. Based in Cambridge, United Kingdom, Alexander has 16 years of experience in transforming high-tech innovations from R&D into high-volume commercial products. In his  current capacity, Alexander is focussed on establishing a network of early adopters for Forefront RF’s pioneering Foretune™ technology and delivering a commercially viable RF solution by 2026. 
Extending broadband S-parameter calibration to mK temperatures
Faisal Mubarak (VSL)
Extending broadband S-parameter calibration to mK temperatures
Faisal Mubarak (VSL)
Extending calibrated broadband S-parameter measurements to millikelvin temperatures is critical for further developing the quantum supply chain. This talk will provide an overview of the latest cryogenic RF developments at VSL, introducing the new measurement system for calibrated S-parameters up to 26.5 GHz. We’ll discuss the usage of existing calibration techniques employed with novel measurement strategies to establish calibrated cryogenic measurements supported with detailed error analysis. Finally, the talk will highlight critical error contributors for increasing measurement confidence in cryogenic conditions.
Faisal Ali Mubarak received his BSc degree in electrical engineering from the Rijswijk Polytechnic Institute of Technology, Rijswijk, the Netherlands, in 2006 and the MSc degree in electrical engineering from Delft University of Technology in 2009. Also in 2009, he joined VSL, the national measurement institute of the Netherlands, where he’s presently a principal scientist on RF & MW measurements. His research interests include developing RF measurement solutions up to mm-wave frequencies. In 2017, he was one of the co-founders of Vertigo Technologies, a Delft-based company developing novel measurement solutions and instruments.

15:30-16:00

Circuit design

15:30-16:00

Test & measurement

Phased-array chips for satcom: a modular approach
Shailesh Kulkarni (Tusk IC)
Phased-array chips for satcom: a modular approach
Shailesh Kulkarni (Tusk IC)
Satellite communication is gaining rapid interest in both commercial and defense markets, with growing Leo constellations and the imminent launch of new initiatives. Plenty of effort is spent on the ground terminals, which connect to the many orbiting satellites using phased arrays. As the number of radiating elements and the RF chip count per terminal increase, multiplied by the large volume of earth-side users, the importance of integration and cost reduction can’t be ignored. A seemingly good match for CMOS-based ICs, with a space twist. Together with the European Space Agency, Tusk IC is developing a modular, antenna-in-package solution. Using a holistic approach by co-designing chips, antennas and packaging, a ‘tile-like’ component is created that greatly simplifies the assembly of satcom flat-panel phased arrays.
Shailesh Kulkarni holds an MSc and PhD in electrical engineering from KU Leuven, specializing in mm-wave CMOS circuit design. His research contributed to advancements in broadband communication and resulted in multiple publications. In 2015, he joined M4S/Huawei in Leuven as an RFIC design specialist, where he worked on the development of cellular front-end modules for high-volume consumer smartphones. In 2018, he co-founded Tusk IC, a fabless mm-wave IC design company where he serves as chief technology officer and is involved in the design and development of custom RFIC solutions for applications like 5G, radar, ADAS and sensing. In addition to these areas, Tusk IC is also engaged in developing Ka-band beamforming solutions for terrestrial terminals in satcom.
T&M tackling the challenges of NTN evolving on the path to 6G
Reiner Stuhlfauth (Rohde & Schwarz)
T&M tackling the challenges of NTN evolving on the path to 6G
Reiner Stuhlfauth (Rohde & Schwarz)
3GPP Release 17 is considered the start of non-terrestrial network services in 5G targets. Later releases enhance the NTN contribution and even if 6G may be an evolution and not a revolution, NTN will play a pivotal role there, too.
This talk will outline the technology evolution from the first NTN up to the anticipated technology evolutions on the path to 6G, starting with transparent payload architecture, incorporating regenerative payload and multi-connectivity mobility scenarios on a mid-term basis and then looking to the long-term aspects of 3D unified and resilient networks. We’ll focus on the challenges concerning the architecture evolution as well as specific use cases like the UE accessing the network and we’ll present the evolution of test and measurement aspects and how T&M can ensure the successful operation and development of future NTN networks.
Reiner Stuhlfauth is a technology manager wireless from the Test & Measurement Division of Rohde & Schwarz in Munich. He has more than twenty years of experience in teaching and promoting mobile communication technologies, both cellular and non-cellular. He’s involved in several projects concerning 5G, 5G Advanced and 6G research activities. He holds the academic degree of engineer in telecommunications (Dipl.-Ing) issued by the Technical University of Kaiserslautern.

16:00-16:30

Break

16:30-16:45

EuMA PhD Award

The best PhD pitch, selected by the academic members of the program committee, receives € 1,000, sponsored by EuMA

16:45-17:30

Keynote

Phased-array antenna: are we finally there?
Carolina Vigano (Viasat)
Phased-array antenna: are we finally there?
Carolina Vigano (Viasat)
The upcoming of LEO constellations is pushing phased-array antennas into the market, transforming a technology that was considered until today as a nice to have into a necessity. Depending on the specific application, parameters like the frequency band addressed, the scan angle required and the need for multiple beams do vary greatly. For this reason, there doesn’t exist an array antenna that’s recognized as the best for all the applications. Different implementation solutions should be considered and traded.
In this talk, after a quick review of the existing alternatives, the configuration chosen by Viasat for a Ka-band satcom antenna system will be presented. The application of the selected architecture will be shown applied to different verticals from the airborne market to the land mobile one and even to the space segment. Design challenges for the specific antenna architecture will be disclosed and discussed. Finally, a roadmap with the technical features envisaged as necessary for future terminals will be presented, paying special attention to the innovation required on the chipsets that would enable such features.
Maria Carolina Viganó received the Laurea (summa cum laude) degree in telecommunication engineering from the University of Florence and the PhD degree co-sponsored by Delft University of Technology, Thales Alenia Space Toulouse and ESA-ESTEC. After years as a R&D antenna engineer at ESA first and later Viasat, she’s now leading the Terminal and Payload Development Group. Her research interests include phased arrays, satellite communication antennas and synthesis techniques for non-regular arrays.

Drinks & dinner

Register

Premium Plus members of Bits&Chips and High-Tech Systems and members of our partners EuMA, IEEE and IR Search can register with a discount. The discount will be applied when entering your personal discount code.
An entrance ticket to the event includes admission to the presentations, to the exhibition floor, lunch, drinks and a networking dinner at the end of the day.

Standard ticket

€ 350

Partner ticket

€ 325

Discount ticket

€ 300

About

Topics

Sessions on product-specific applications with a focus on innovative solutions in combination with advanced wireless technology
In-depth sessions highlighting trends such as RF energy and RF power and focusing on engineers, designers and technical managers in the advanced RF field

Target audience

Engineers
Team leaders
Technical managers
Product developers
Innovation managers

Location

Mikrocentrum
De Run 1115
5503 LB Veldhoven

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